AOI Solder Pallet Material
| Materials | Ni + Co Alloy (400~500HV ) |
| Thickness | Min 20um ~ Max 120um |
| Metal Size | 590mm×560mm |
| Pattern Range | 400mm×400mm |
| Open Pattern – TOP/BOT Gap | Min. 1:1.2 of Thickness (50㎛) |
| Thickness Tolerance (Pattern range) | Within ±10% of Thickness |
| Open Hole Tolerance (㎛) | ± 3㎛ |
| Location Tolerance
(X,Y Axis Pattern range) |
-30㎛~+15㎛ |
Comparison of most common 3 types of stencil fabrication
Laser cut
Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout
Etching
Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout
Eformed
Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout
Characteristic & Application
Position accuracy improved 40% compare to Laser cut
Completely burr free and absolutely smooth aperture wall surface
No Electro-Polishing and Nano Coating required
Increase transfer efficiency especially for fin pitch/precise-pitch application
Pro-long life span of metal mask stencil by up to 40%
High-end SMT process such as FBGA application
Semiconductor back-end packaging level process such as wafer bump
Flip chip wafer level assembly application as Ball Drop mask
Solar cell fabrication process as metallization screen printing
QHD OLED organic evaporation process as photo metal mask