Electro Formed Nickel Stencil

///Electro Formed Nickel Stencil
Electro Formed Nickel Stencil 2018-09-24T15:26:26+00:00

AOI Solder Pallet Material

Electro formed nickel process
Materials Ni + Co Alloy (400~500HV )
Thickness Min 20um ~ Max 120um
Metal Size 590mm×560mm
Pattern Range 400mm×400mm
Open Pattern – TOP/BOT Gap Min. 1:1.2 of Thickness (50)
Thickness Tolerance (Pattern range) Within ±10% of Thickness
Open Hole Tolerance (㎛) ± 3
Location Tolerance

(X,Y Axis Pattern range)

-30㎛~+15㎛

Comparison of most common 3 types of stencil fabrication

Laser cut

Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout

Etching

chemical etching

Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout

Eformed

eformed surface

Direct Laser Cut processing Quick delivery Good continuous printing Good soldering paste dropout

Characteristic & Application

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  • Position accuracy improved 40% compare to Laser cut

  • Completely burr free and absolutely smooth aperture wall surface

  • No Electro-Polishing and Nano Coating required

  • Increase transfer efficiency especially for fin pitch/precise-pitch application

  • Pro-long life span of metal mask stencil by up to 40%

  • High-end SMT process such as FBGA application

  • Semiconductor back-end packaging level process such as wafer bump

  • Flip chip wafer level assembly application as Ball Drop mask

  • Solar cell fabrication process as metallization screen printing

  • QHD OLED organic evaporation process as photo metal mask